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1. Materials and Plating (Unit: Micro-Inches) |
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Structure |
Material |
Plating |
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Body (SMA) |
Stainless Steel |
Passivation |
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Body (Probe) |
Be-Cu |
Gold |
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Contact PIN |
Be-Cu |
Gold |
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Insulator |
Teflon |
N/A |
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Spring |
SWP |
Gold |
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2. Electrical Characteristics |
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Impedance |
50 ohm |
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Voltage Rating |
335 V(rms) |
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Frequency Range |
DC 0~6GHz |
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Withstanding Voltage |
500 V |
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Center Contact Resistance |
≤70 mOhm |
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Outer Contact Resistance |
≤20 mOhm |
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Insulation Resistance |
≥500 Mohm |
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VSWR |
≤1.30:1 (DC 0~3GHz) |
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Insertion Loss |
≤0.3dB (DC 0~3GHz) |
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3. Mechanical Characteristics |
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Durability |
SMA ≥ 500 cycles |
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Contact PIN Retention Force |
≥ 6 LBS |
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Engagement Strokes |
0.6mm (Reference) |
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Engagement Force |
5 ~ 8 N (Reference) |
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4. Environmental Characteristics |
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Operation Temperature Range |
-40 °C ~ +85 °C |
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